According to the WINWIN 2030 strategy, Ukraine is interested in the production of chips using 110-180 nm technology. Currently, an expert group is developing a strategy for the development of the semiconductor industry under the auspices of the ministry, which envisages achieving progress by 2035. The strategy will soon be presented to the public.
According to the WINWIN 2030 strategy, Ukraine is interested in the production of chips using 110-180 nm technology. Currently, an expert group is developing a strategy for the development of the semiconductor industry under the auspices of the ministry, which envisages achieving progress by 2035. The strategy will soon be presented to the public.
This was stated by members of the expert group at the Ministry of Digital Affairs at the DOU Day 2025 panel discussion.
On January 14, the Cabinet of Ministers approved the Innovation Strategy until 2030 from the Ministry of Digital Affairs, according to which Ukraine seeks to establish its own chip production .
The Ministry of Digital Affairs wants to launch the production of chips with sizes of 180, 130 and 110 nanometers (nm), which are also called “mature nodes”. While advanced technology giants such as Samsung, TSMC produce chips with sizes from 3 to 7 nm. They are used mainly for high-performance computing and complex logic, which are not currently a priority for Ukraine.
The cost of building a factory on advanced nodes (5-7 nm) is tens of billions of dollars, which is financially unattainable for Ukraine. Instead, one module on “mature” nodes will cost about $1 billion, which is more realistic.
Experts emphasize the mandatory and significant participation of the state for the success of the project, referring to world experience, in particular, to the TSMC case. The state can provide state orders and improve the factory's position. The financing and management model (private, public or public-private) is still being determined.
As explained by expert group member Yevgeny Astakhov, there is Pureplay Foundry — a foundry that covers the full technological cycle from a single-crystal “blank” (plate) to a finished chip. This includes photolithography, etching, and packaging. Even for “mature” nodes, this process includes hundreds, if not thousands, of sequential operations.
But there is a risk — security in wartime. Large factories occupy a significant area, require an extensive ecosystem of support (water, air, energy), and are very sensitive to vibrations and damage. Even an indirect hit can put them out of action for many months.
As an alternative or complement, the concept of Small Clean Rooms is being considered. These are more compact production facilities that can be used for prototyping or small batches of low-cost chips. They can be more secure, as they can even be located underground, as is the case in Japan. This approach can precede or complement the construction of a large factory.
Small Clean Room deployment can take up to two years. Pureplay Foundry construction is approximately 3-5 years from the start of construction (2-3 years construction, 1-2 years pilot operation, full cycle).
