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Member of the expert team at the Ministry of Digital Affairs: "Why not offer the US the construction of microchip factories in Ukraine as part of the agreement on raw materials? Trump loves such ideas"

Oleksandr Grudanov, a member of the expert team at the Ministry of Digital Affairs and Senior Director of Advanced R&D at Silvaco Group, believes that Ukraine should offer the US a project to build microchip factories as part of the agreement on rare earth metals, which is currently being widely discussed at the highest level.

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Member of the expert team at the Ministry of Digital Affairs: "Why not offer the US the construction of microchip factories in Ukraine as part of the agreement on raw materials? Trump loves such ideas"

Oleksandr Grudanov, a member of the expert team at the Ministry of Digital Affairs and Senior Director of Advanced R&D at Silvaco Group, believes that Ukraine should offer the US a project to build microchip factories as part of the agreement on rare earth metals, which is currently being widely discussed at the highest level.

«Why don’t we approach this issue with a bold strategy? After all, Trump loves such ideas. What are we losing? Discussing critical raw materials on a global level and not taking the opportunity to approach the topic of semiconductors, new supply chains, etc. would be, to put it mildly, unwise,» he expressed his vision on his Facebook page.

He also believes that the United States could participate in the project under Lend-Lease.

«We will create a new business model — a semiconductor factory in lend-lease. We will repay the debt with silicon wafers and finished chips,» the expert adds.

Grudanov recalled that Elon Musk needs High-Voltage MOSFET (600V-800V) for Tesla, and he needs large volumes of this product.

«For their production (on SiC, GaN), 180nm is enough, even 350nm is suitable, which is quite within our capabilities. Currently, most of these chips are produced by China,» says a member of the expert team at the Ministry of Digital Affairs.

According to Oleksandr Grudanov, the market needs not only AI chips for HPC data centers, but also communication chips for communication between data center nodes, in particular silicon photonics starting at 250 nm.

«Ukraine has significant reserves of silicon and germanium, which can be mined and processed in Ukraine. In SiGe microelectronics, BiCMOS technology is used for RF applications (high-frequency communications, satellite communications, etc.). This is not even taking into account the military-industrial complex, which has its own specific needs, in particular Rad-Hard chips. Having experience, school, historical background, we can quickly master technological standards in the range of 350nm -110nm,» the expert is confident.

Grudanov summarized that the US could transfer preserved production lines of 350nm, 250nm, 180nm, 130nm chips to Ukraine through technological lend-lease, while the most advanced technological processes would be gradually transferred from Taiwan to the US.

Recall that on January 14, the Cabinet of Ministers approved the Innovation Strategy until 2030 from the Ministry of Digital Affairs, according to which Ukraine seeks to establish its own chip production .

Previously, they had hoped to develop and present a Ukrainian chip as early as 2024, but as it turned out, such plans were premature.

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